Computer mother board zoomed photography

Services

SNF Foundry Consulting,

Device Characterization  Service

and Wire Bonding Services

 

Stratio provides device fabrication and consultation services for R&D and small volume production. Expertise includes Read Out Integrated Circuit (ROIC) design/implementation for CMOS and MEMS based devices and various wafer processing techniques, including various film deposition, CMP, and wafer bonding & layer transfer; also low volume wire bonding services, custom PCB design/implementation.

 

Contact:  [email protected]

· SNF Foundry Consulting Service

Capability

Probe Station: Micromanipulator MM8060

Parameter Analyzer: Keysight B1500A

Microscope + Camera: Nikon Optiphot 150 + Amscope MU500

Scanning Electron Microscopy (SEM): Phenom Pure (below 10 nm resolution)

 

Pickup and dropoff service is available for Stanford University students/postdocs.

 

Contact:  [email protected]

· Device Characterization Service

We provide device measurement services with Probe Station, Parameter Analyzer, OM, and SEM.

· Wire Bonding Service

We specialize in handling small volume wire bonding jobs and provide fast turn around time of one to two business days.

Capability 

Westbond 7476E-79, with wedge to wedge bonding module.

Aluminum wire (25 um dia.) bonding using ultrasonic method.

1-2 business day turn around.

Pickup and dropoff service is available for Stanford University students/postdocs.

 

Contact:  [email protected]

© 2017-2019 Stratio, Inc.

1863 Concourse Drive, San Jose, CA 95131, U.S.A

[email protected]

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Computer mother board zoomed photography
Computer mother board zoomed photography

Services

SNF Foundry Consulting,

Device Characterization  Service and Wire Bonding Services

Stratio provides device fabrication and consultation services for R&D and small volume production. Expertise includes Read-Out Integrated Circuit (ROIC) design/implementation for CMOS and MEMS based devices and various wafer processing techniques, including various film deposition, CMP, and wafer bonding & layer transfer; also low volume wire bonding services, custom PCB design/implementation.

 

Contact [email protected]

Capability

Probe Station: Micromanipulator MM8060

Parameter Analyzer: Keysight B1500A

Microscope + Camera: Nikon Optiphot 150 + Amscope MU500

Scanning Electron Microscopy (SEM): Phenom Pure (below 10 nm resolution)

 

Pickup and dropoff service is available for Stanford University students/postdocs.

 

Contact:  [email protected]

1863 Concourse Drive, San Jose, CA 95131, U.S.A

[email protected]