Computer mother board zoomed photography

Services

SNF Foundry Consulting,

Device Characterization  Service

and Wire Bonding Services

 

SNF Foundry Consulting

Device Characterization

Wire Bonding

Stratio provides device fabrication and consultation services for R&D and small volume production. Expertise includes Read Out Integrated Circuit (ROIC) design/implementation for CMOS and MEMS based devices and various wafer processing techniques, including various film deposition, CMP, and wafer bonding & layer transfer; also low volume wire bonding services, custom PCB design/implementation.

 

Contact:  [email protected]

We provide device measurement services with Probe Station, Parameter Analyzer, OM, and SEM.

Capability

Probe Station: Micromanipulator MM8060

Parameter Analyzer: Keysight B1500A

Microscope + Camera: Nikon Optiphot 150 + Amscope MU500

Scanning Electron Microscopy (SEM): Phenom Pure (below 10 nm resolution)

 

Pickup and dropoff service is available for Stanford University students/postdocs.

 

Contact:  [email protected]

We specialize in handling small volume wire bonding jobs and provide fast turn around time of one to two business days.

Capability 

Westbond 7476E-79, with wedge to wedge bonding module.

Aluminum wire (25 um dia.) bonding using ultrasonic method.

1-2 business day turn around.

Pickup and dropoff service is available for Stanford University students/postdocs.

 

Contact:  [email protected]

© 2017-2019 Stratio, Inc.

4019 Transport St, Palo Alto, CA 94303, U.S.A

[email protected]

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Computer mother board zoomed photography
Computer mother board zoomed photography

Services

SNF Foundry Consulting,

Device Characterization  Service and Wire Bonding Services

  • SNF Foundry Consulting

    Stratio provides device fabrication and consultation services for R&D and small volume production. Expertise includes Read-Out Integrated Circuit (ROIC) design/implementation for CMOS and MEMS based devices and various wafer processing techniques, including various film deposition, CMP, and wafer bonding & layer transfer; also low volume wire bonding services, custom PCB design/implementation.

     

    Contact [email protected]

  • Device Characterization

    We provide device measurement services with Probe Station, Parameter Analyzer, OM, and SEM.

    Capability

    Probe Station: Micromanipulator MM8060

    Parameter Analyzer: Keysight B1500A

    Microscope + Camera: Nikon Optiphot 150 + Amscope MU500

    Scanning Electron Microscopy (SEM): Phenom Pure (below 10 nm resolution)

     

    Pickup and dropoff service is available for Stanford University students/postdocs.

     

    Contact:  [email protected]

  • Wire Bonding

    We specialize in handling small volume wire bonding jobs and provide fast turn around time of one to two business days.

    Capability 

    Westbond 7476E-79, with wedge to wedge bonding module.

    Aluminum wire (25 um dia.) bonding using ultrasonic method.

    1-2 business day turn around.

    Pickup and dropoff service is available for Stanford University students/postdocs.

     

    Contact:  [email protected]

4019 Transport St, Palo Alto, CA 94303, U.S.A

[email protected]