About

STNF provides expert design & fabrication services at our in-house facilities.

Located in San Jose, as a partner of the Stanford Nanofabrication Facility (SNF),

we also offer SNF consulting services with micro and nano devices.

The STNF offers

CMP

PR COATING

STEPPER

WIRE BONDING

Equipment: Strasbaugh 6EC

Equipment: Strasbaugh 6EC

Service Provided

Remove unwanted conductive or dielectric materials on the wafers utilizing a chemical slurry formulation and mechanical polishing process.

Conditions

  • Wafer: 4” Standard only
  • Accepted materials: Silicon, Germanium, Oxide, Nitride
  • Unaccepted materials: III-V, any Metal and Metal Oxide
  • Unlisted materials: Open for discussion

About our CMP

Procedure

*Shipping Address

STNF LLC, 2211 Fortune Drive, Suite A, San Jose, CA 95131

Conditions

  • Wafer: 4” Standard only
  • Accepted materials: Silicon, Germanium, Oxide, Nitride
  • Unaccepted materials: III-V, any Metal and Metal Oxide
  • Unlisted materials: Open for discussion

Equipment: TEL Mark 5z

Equipment: TEL Mark 5z

Service Provided

Provide linear wafer tracks resist coating for wafers.

Conditions

  • Wafer: 4” Standard only
  • Coater :

    SPR3612, 1 μm, No Top EBR / SPR3612, 1.6 μm, No Top EBR

    SPR3612, 1 μm, 5 mm EBR / SPR3612, 1.6 μm, 5 mm EBR

About our PR COATER

Procedure

*Shipping Address

STNF LLC, 2211 Fortune Drive, Suite A, San Jose, CA 95131

Conditions

  • Wafer: 4” Standard only
  • Coater :

    SPR3612, 1 μm, No Top EBR / SPR3612, 1.6 μm, No Top EBR

    SPR3612, 1 μm, 5 mm EBR / SPR3612, 1.6 μm, 5 mm EBR

Equipment: ASML 5000/50
(compatible with ASML 5500)

Equipment: ASML 5000/50 (compatible with ASML 5500)

Service Provided

Provide linear wafer tracks resist coating for wafers and project the image of a circuit in photolithographic semiconductor fabrication.

Conditions

  • Wafer: 4” Standard only
  • Reticles: 1 layer/reticle, up to 5 reticles/service

About our STEPPER

Procedure

*Shipping Address

STNF LLC, 2211 Fortune Drive, Suite A, San Jose, CA 95131

Conditions

  • Wafer: 4” Standard only
  • Reticles: 1 layer/reticle, up to 5 reticles/service

Equipment: WestBond 7476E-79

Equipment: WestBond 7476E-79

Service Provided

Create electrical interconnections between semiconductors and silicon chips using bonding wires.

Conditions

  • Pitch size*

    Pad size: 50x50 μm or larger

    Pitch size: 200 μm or larger

About our WIRE BONDING

Procedure

*Shipping Address

STNF LLC, 2211 Fortune Drive, Suite A, San Jose, CA 95131

Conditions

  • Pitch size*

    Pad size: 50x50 μm or larger

    Pitch size: 200 μm or larger

Stratio, the provider of STNF services, is an independent consultant of Stanford Nanofabrication Facility (SNF).

We provide industry-leading device fabrication and consultation services for R&D and small volume production.

Our expertise includes ROIC design/implementation for CMOS and MEMS-based devices and wafer processing techniques, including film deposition, CMP, wafer bonding and layer transfer.